The logo of Bosch is seen at an office building in Kyiv, Ukraine July 6, 2020.
REUTERS/Valentyn Ogirenko/File PhotoBERLIN, Aug 8 (Reuters) - German technology group Robert Bosch (ROBG.UL) said on Tuesday that it will establish a joint venture with TSMC (2330.TW), Infineon (IFXGn.DE) and NXP (NXPI.O) with the aim of building a wafer fab in Dresden, Germany, by the second half of next year.
The joint venture will be 70% owned by TSMC, with Bosch, Infineon and NXP each holding a 10% equity stake, according to a statement, and total investments are expected to exceed 10 billion euros ($10.97 billion) via equity injection, debt borrowing, and strong support from the European Union and German government.
($1 = 0.9120 euros)Writing by Miranda Murray, Editing by Friederike HeineOur Standards: The Thomson Reuters Trust Principles.
Persons:
Valentyn, Robert Bosch, Miranda Murray, Friederike Heine Our
Organizations:
Bosch, REUTERS, TSMC, Infineon, European Union, Thomson
Locations:
Kyiv, Ukraine, Dresden, Germany