Advanced chip packaging is a crucial technology that squeezes the most horsepower from the latest chip designs, and is crucial to chip contract manufacturers vying for business. The data from LexisNexis, released last month, indicates that TSMC and Samsung have steadily invested in advanced packaging technology for years, as Intel did not keep pace with its own filings. Packaging technology enabled the industry to stitch together several chips called "chiplets" - either stacked or adjacent to one another - within the same container. Samsung has been investing in advanced packaging for years but the South Korean chip giant established a dedicated team to pursue advanced packaging in December 2022, Moonsoo Kang, the unit's chief, said in a statement. Intel disputed the idea that the size of TSMC's patent portfolio indicated that it had developed more advanced technology.

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Persons: Dado Ruvic, TSMC, ”, Marco Richter, Moonsoo Kang, Benjamin Ostapuk, Max A, Matthew Lewis Organizations: Taiwan Semiconductor Manufacturing, REUTERS, Reuters, Samsung Electronics, Intel, LexisNexis, Samsung, Devices, Thomson Locations: San Francisco