REUTERS/Nacho DoceTOKYO/SEOUL, March 31 (Reuters) - South Korea's Samsung Electronics Co Ltd (005930.KS) is considering setting up a chip test line in Japan, five people said, to bolster its advanced packaging business and forge closer ties with Japanese makers of semiconductor equipment and materials. It would be the first such test line in Japan for Samsung, the world's largest maker of memory chips. Companies are racing to develop advanced packaging techniques, which involve placing chips with different functions into a single package, to enhance overall capabilities and limit the added cost of more advanced chips. The test line would involve the so-called back-end process of chipmaking, according to the five people, which refers to a process in which semiconductors are cut and assembled into products. Samsung last year set up an advanced packaging team in South Korea.

---