Worker walks outside the new semiconductor plant by Japan Advanced Semiconductor Manufacturing Company (JASM), a subsidiary of Taiwan's chip giant TSMC, in Kikuyo of the Kikuchi district, Kumamoto prefecture.
Taiwan's TSMC is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a move that would add momentum to Japan's efforts to reboot its semiconductor industry.
Taiwan's TSMC is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a move that would add momentum to Japan's efforts to reboot its semiconductor industry.
One option the chipmaking giant is considering is bringing its chip on wafer on substrate, or CoWoS, packaging technology to Japan, according to one of the sources who was briefed on the matter.
Demand for advanced semiconductor packaging has surged globally in tandem with the artificial intelligence boom, spurring chipmakers including TSMC, Samsung Electronics and Intel , to boost capacity.
Persons:
TSMC
Organizations:
Japan Advanced Semiconductor Manufacturing Company, Taiwan Semiconductor Manufacturing, TSMC, Samsung Electronics, Intel
Locations:
Japan, Kikuyo, Kikuchi, Kumamoto prefecture, Taiwan's, Taiwan