"U.S.-China competition is on the same starting line," Chipuller chairman Yang Meng said about chiplet technology in an interview with Reuters.
"They can still develop 3D stacking or other chiplet technology to work around those restrictions.
Beijing is rapidly exploiting chiplet technology in applications as diverse as artificial intelligence to self-driving cars, with entities from tech giant Huawei Technologies to military institutions exploring its use.
About a quarter of the global chip packaging and testing market sits in China, according to Dongguan Securities.
Huawei, China’s tech and chip design giant that has been put on the U.S.'s most restricted list, has been actively filing chiplet patents.
Persons:
Yang Meng, Charles Shi, Needham, Yang, Needham's Shi, Chipuller, Laura Black, Melissa Mannino, Perry Bechky, Rowe, Mike Gallagher, Biden, ”, Chipuller's Yang, zGlue, CFIUS, Shayne Phillips, MIIT, Jane Lanhee Lee, Eduardo Baptista, Echo Wang, Stephen Nellis, Kenneth Li, Brenda Goh, Lincoln
Organizations:
Chipuller, Industry, Reuters, Huawei Technologies, Intel, Dongguan Securities, People’s Liberation Army, PLA, Acclaim, British, Islands, Sea Investment Co, Foreign Investment, Treasury, Akin's Trade, Berliner Corcoran, Department of Commerce, Huawei, U.S, TongFu Microelectronics, JCET, Beijing ESWIN Technology Group, China’s Ministry of Industry, Information Technology, Thomson
Locations:
Shenzhen, China, U.S, United States, Japan, South Korea, Taiwan, Beijing, Dongguan, BakerHostetler, People's Republic of China