TAIPEI, July 25 (Reuters) - Driven by a surge in demand for artificial intelligence, Taiwanese chip maker TSMC (2330.TW) plans to invest nearly T$90 billion ($2.87 billion) in an advanced packaging facility in northern Taiwan, the company said on Tuesday.
"To meet market needs, TSMC is planning to establish an advanced packaging fab in the Tongluo Science Park," the company said in a statement.
For advanced packaging, especially TSMC's chip on wafer on substrate (CoWoS), capacity is "very tight," Wei said after the company reported a 23% fall in second-quarter profit.
Even as the leading Apple (AAPL.O) supplier ramps up its expansion abroad, it plans to keep its most advanced chip technology in Taiwan, a global powerhouse in manufacturing semiconductors that power everything from smartphones to electric vehicles.
($1 = 31.3230 Taiwan dollars)Reporting by Sarah Wu and Yimou Lee; Editing by Kim Coghill and Jamie FreedOur Standards: The Thomson Reuters Trust Principles.
Persons:
TSMC, C.C, Wei, chipmaker, Sarah Wu, Yimou Lee, Kim Coghill, Jamie Freed
Organizations:
Nvidia Corp, Devices, Apple, Thomson
Locations:
TAIPEI, Taiwan, Miaoli